Solder Alloys Databases

TCSLD5 is a thermodynamic and properties database for applications to solder and brazing alloys. The database enables pre-screening of potential solder candidate compositions and predictions of various thermodynamic properties and phase equilibria. The database also provides information on possible interfacial reactions.

The results from these predictions can be applied to eliminate candidate solder alloys for which the calculations reveal unsuitable freezing temperature ranges and undesired phases from further testing. Thus, the database can accelerate design of new solder alloys as well as improve understanding of existing solder alloys in terms of their processing and in-service behavior.

The TCSLD5 database contains all the important solder alloy systems, such as Sn-/Au-/Bi-/Zn-based solders and Cu, Ni, Pd, and so on, relevant substrate or metallization materials.

TCSLD5 was developed to be used with our entire suite of products: Thermo-Calc, the Add-on Modules, and all available SDKs.

• Technical Information Sheet for TCSLD5
• Examples Collection for TCSLD5

MOBSLD2 is a corresponding mobility database that provides kinetic data for those working with the Add-on kinetic modules – the Diffusion Module (DICTRA) and the Precipitation Module (TC-PRISMA) – as well as a few specific calculation types, such as Scheil with back diffusion. If you do not purchase a license for an Add-on kinetic module, you most likely do not need a mobility database. One of our technical sales representatives would be happy to help you determine whether your work will require a mobility database.

MOBSLD2 is compatible and recommended to be used in combination with TCSLD5.

• Technical Information Sheet for MOBSLD2