Copper-based Alloys Databases

TCCU4 is our thermodynamic and properties database designed for use with copper-based alloys. MOBCU4 is the corresponding mobility database needed for use with the add-on kinetic modules.

Technical Information Sheet for TCCU4

Technical Information Sheet for MOBCU4

Examples Collection for TCCU4

TCCU4 Quick Overview

  • PROPERTIES:
    • Gibbs Energy
      • Volume
        • Surface tension of liquid
          • Viscosity of liquid
          • ELEMENTS: Ag, Al, Au, As, B, Be, Bi, C, Ca, Cd, Co, Cr, Cu, Fe, Ge, Mg, Mn, Mo, Nb, Ni, O, P, Pb, Pt, Se, Si, Sn, Ti, Zn, Zr
          • ASSESSED PHASES: 257

TCCU4 for Thermodynamic and Properties Data

TCCU4 is a thermodynamic and properties database for copper-based alloys. It includes nearly all stable phases in the assessed systems that may form in as-cast and aged Cu-based alloys.

TCCU4 was developed to be used with our entire suite of products: Thermo-Calc, the Add-on Modules, and all available SDKs.

MOBCU4 for Kinetic Data

MOBCU4 is a corresponding mobility database that provides kinetic data for those working with the add-on kinetic modules – the Diffusion Module (DICTRA) and the Precipitation Module (TC-PRISMA) – as well as a few specific calculation types, such as Scheil with back diffusion. If you do not purchase a license for an add-on kinetic module, you most likely do not need a mobility database. One of our technical sales representatives can help you determine whether your work requires a mobility database.

MOBCU4 is compatible and recommended to be used in combination with TCCU4.

Publications on the Development of TCCU and MOBCU

The following publications discuss the development of the TCCU and MOBCU databases. The first one is Open Access and the second is made available through a generous agreement with J-STAGE.

Ying Tang, Qing Chen, Anders Engström
Kinetic Simulations of Diffusion-Controlled Phase Transformations in Copper-based Alloys
Diffusion Foundations, Volume 15 (2018), pp. 1-22
Read the paper

Qing Chen, Ying Tang, Anders Engström
Developing Thermodynamic and Kinetic Databases for Cu-Based Alloy Design
Journal of Japan Institute of Copper, Volume 59 (2020) Issue 1, pp. 7-12
Read the paper

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