Copper-based Alloys Databases

TCCU6 is a thermodynamic and properties database for copper-based alloys. It includes nearly all stable phases in the assessed systems that may form in as-cast and aged Cu-based alloys.

TCCU6 was developed to be used with our entire suite of products: Thermo-Calc, the Add-on Modules, and all available SDKs.

• Technical Information Sheet for TCCU6
• Examples Collection for TCCU6

MOBCU5 for Kinetic Data

MOBCU5 is a corresponding mobility database that provides kinetic data for those working with the add-on kinetic modules – the Diffusion Module (DICTRA) and the Precipitation Module (TC-PRISMA) – as well as a few specific calculation types, such as Scheil with back diffusion. If you do not purchase a license for an add-on kinetic module, you most likely do not need a mobility database. One of our technical sales representatives can help you determine whether your work requires a mobility database.

MOBCU5 is compatible and recommended to be used in combination with TCCU6.

• Technical Information Sheet for MOBCU5

The following publications discuss the development of the TCCU and MOBCU databases. The first one is Open Access and the second is made available through a generous agreement with J-STAGE.

Ying Tang, Qing Chen, Anders Engström
Kinetic Simulations of Diffusion-Controlled Phase Transformations in Copper-based Alloys
Diffusion Foundations, Volume 15 (2018), pp. 1-22
Read the paper

Qing Chen, Ying Tang, Anders Engström
Developing Thermodynamic and Kinetic Databases for Cu-Based Alloy Design
Journal of Japan Institute of Copper, Volume 59 (2020) Issue 1, pp. 7-12
Read the paper